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開本：128開 紙張：膠版紙 包裝：平裝-膠訂 是否套裝：否 國際標準書號ISBN：9787122394484 叢書名：先進電子封裝技術與關鍵材料叢書 作者：李世瑋（Shi-Wei 出版社：化學工業出版社 出版時間：2021年12月
"編輯推薦 固體照明其主要優勢是節能、環境友好和長壽命，而LED（發光二極管）封裝是獲得這些優點的主要保障技術。本書全面闡述上述照明技術，介紹LED特點。LED封裝中的關鍵技術如互連、發光磷粉沉積、包封等將會重點闡述，同時兼顧熱管理和可靠性的評估，以及光學設計、分析和特征。LED在通用固體照明和特殊照明中的應用將會重點介紹。同時討論技術線路圖有關內容。
本選題作者李世瑋教授是國際知名的電子封裝領域專家，是IEE件封裝制造技術學會（CPMT Society）的全球總裁；英國物理學會、美國機械工程師學會（ASME）和IEEE的會士（Fellow）。已出版3本電子封裝領域的英文學術專著，在學術界及出版界均享有盛譽。
本書特點如下：
1. 涵蓋照明、色度學、光度學、發光二極管的基本原理；
2. 全面介紹了LED晶圓和芯片的制程、LED芯片封裝、LED晶圓級封裝、板級組裝與LED模組、光學與電學表征、熱管理、可靠性、以及封裝材料等相關內容。
3. 重點闡述了LED封裝中的關鍵技術如互連、熒光粉沉積、塑封等。
4. LED在通用固體照明和特殊照明中的應用
5. 還討論了技術線路圖有關內容。
固體照明其主要優勢是節能、環境友好和長壽命，而LED（發光二極管）封裝是獲得這些優點的主要保障技術。本書全面闡述上述照明技術，介紹LED特點。LED封裝中的關鍵技術如互連、發光磷粉沉積、包封等將會重點闡述，同時兼顧熱管理和可靠性的評估，以及光學設計、分析和特征。LED在通用固體照明和特殊照明中的應用將會重點介紹。同時討論技術線路圖有關內容。
本選題作者李世瑋教授是國際知名的電子封裝領域專家，是IEE件封裝制造技術學會（CPMT Society）的全球總裁；英國物理學會、美國機械工程師學會（ASME）和IEEE的會士（Fellow）。已出版3本電子封裝領域的英文學術專著，在學術界及出版界均享有盛譽。
本書特點如下：
1. 涵蓋照明、色度學、光度學、發光二極管的基本原理；
2. 全面介紹了LED晶圓和芯片的制程、LED芯片封裝、LED晶圓級封裝、板級組裝與LED模組、光學與電學表征、熱管理、可靠性、以及封裝材料等相關內容。
3. 重點闡述了LED封裝中的關鍵技術如互連、熒光粉沉積、塑封等。
4. LED在通用固體照明和特殊照明中的應用
5. 還討論了技術線路圖有關內容。
6. 讀者將會從書中的工藝過程及實驗數據中獲益。
7. 本書中大量的技術內容是作者的實踐成果和實驗成果，具有很強的產業化實踐指導意義。讀者將會從書中的工藝過程及實驗數據中獲益。
內容簡介 固體照明其主要優勢是節能、環境友好和長壽命，而LED（發光二極管）封裝是獲得這些優點的主要保障技術。本書不僅涵蓋照明、色度學、光度學、發光二極管的基本原理，同時全面介紹了LED 晶圓和芯片的制程、LED 芯片封裝、LED 晶圓級封裝、板級組裝與LED 模組、光學與電學表征、熱管理、可靠性以及封裝材料等相關內容。尤其重點闡述了LED 封裝中的關鍵技術如互連、熒光粉沉積、塑封等，LED 在通用固體照明和特殊照明中的應用也是本書的重點，還討論了技術線路圖有關內容。本書中大量的技術內容是作者的實踐成果和實驗成果，具有很強的產業化實踐指導意義，讀者將會從書中的工藝過程及實驗數據中獲益。
本書適合從事LED 設計、材料研發、封裝和組裝工藝、可靠性測試和應用等的高校及科研院所的研究人員及工程師使用。
作者簡介 李世瑋，香港科技大學，IEE件封裝制造技術學會（CPMT Society）的全球總裁；英國物理學會、美國機械工程師學會（ASME）和IEEE評選為學會會士（Fellow），深圳研究院常務副院長、機械工程繫教授、博士生導師，兼任先進微繫統封裝中心（CAMP）主任，李世瑋教授於1992年獲得美國普渡大學（Purdue University）航空航天工程博士學位，1993年加入香港科技大學（HKUST）任教，目前是香港科大深圳研究院常務副院長、機械工程繫教授、博士生導師，兼任先進微繫統封裝中心（CAMP）主任，他也曾擔任過香港科大所屬的納米及先進材料研發院（NAMI）的技術總監，並於2010年被派任為佛山市香港科技大學LED-FPD工程技術研究開發中心的創建主任。李教授的研究領域覆蓋晶圓級和三維微繫統封裝、硅通孔（TSV）和高密度互連、LED封裝和半導體照明技術、以及無鉛焊接工藝及焊點可靠性。他的團隊在國際學術期刊及會議論文集上發表了兩百多篇技術論文，其中九篇獲得*佳論文獎。李教授在各類學術活動和國際會議上非常活躍，他曾擔任《IEE件及封裝技術期刊》的總主編，並兼任另外兩份國際學術期刊的編輯顧問。李教授還獲選為IEE件封裝制造技術學會（CPMT Society）的傑出講師，經常受邀到全球各大學、研究單位、跨國公司、國際會議及論壇作專題報告或提供短期課程。由於李教授在國際間的成就及聲望，他於1999、2003和2008年分別被英國物理學會、美國機械工程師學會（ASME）和IEEE評選為學會會士（Fellow）。2012年初當選為IEEE CPMT的全球總裁。
目錄 Preface ⅸ
About the Authors ⅹⅰ
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
Preface ⅸ
About the Authors ⅹⅰ
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.2.1 PTH LED Component 17
2.2.2 SMD LED Component 18
2.3 Chip Mounting and Interconnection 20
2.3.1 Die Attach Adhesive 21
2.3.2 Soldering and Eutectic Bonding 24
2.3.3 Wire Bonding 31
2.3.4 Flip-Chips 34
2.4 Phosphor Coating and Dispensing Process 38
2.4.1 Dispersed Dispensing 39
2.4.2 Conformal Coating 41
2.4.3 Remote Phosphor 45
2.5 Encapsulation and Molding Process 48
2.5.1 Encapsulant Filling with Lens 48
2.5.2 Lens Molding 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies for Wafer Level Packaging 66
3.3.1 Photolithography 66
3.3.2 Wafer Etching 68
3.3.3 TSV Filling 73
3.3.4 Bond Pad Metallization 73
3.3.5 Wafer Level Phosphor Deposition Methods 76
3.3.6 Moldless Encapsulation 87
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.4.1 Reflective Layer Design 91
3.4.2 Cavity and Reflective Cup by Wet Etching 92
3.4.3 Copper-Filled TSVs for Vertical Interconnection and Heat Dissipation 95
3.5 Processes of LED Wafer Level Packaging 96
3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots 96
3.5.2 Case 2: LED WLP with a Cavity 99
3.5.3 Case 3: Applications of an LED WLP Panel 103
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.2.1 Metal Core Printed Circuit Board 112
4.2.2 Printed Circuit Board with Thermal Vias 119
4.2.3 Wave Soldering 124
4.2.4 Surface Mount Reflow 126
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.1.1 Basic Concepts of Radiometric and Photometric 145
5.1.2 Irradiance Measurement Calibration 155
5.1.3 Common Measurement Equipment 156
5.2 Power Supply and Efficiency 159
5.2.1 Electrical Characteristics of LED 159
5.2.2 Power Supply for LEDs 161
5.2.3 Power Efficiency 162
5.3 Consideration of LED Thermal Performance 163
5.3.1 Thermal Characterization Methods for LEDs 163
5.3.2 Thermal Management Methods 170
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.1.1 Reliability of Electronic Components or Systems 175
6.1.2 Common Failure Mechanisms and Reliability Tests 176
6.2 Failure Analysis and Life Assessment 181
6.2.1 Methodology for Failure Analysis 181
6.2.2 Weibull Analysis and Acceleration Model for Life Assessment 182
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.1.1 Development 189
7.1.2 Typical Structures 190
7.1.3 Challenges 191
7.1.4 Conclusion 194
7.2 Micro- and Mini-LED Display 194
7.2.1 Development 195
7.2.2 Typical Structures 200
7.2.3 Challenges 202
7.2.4 Conclusion 203
7.3 LED for Visible Light Communication 203
7.3.1 Development 204
7.3.2 Typical Applications 205
7.3.3 Challenges 206
7.3.4 Conclusion 208
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV LED 213
8.1.1 Structures 213
8.1.2 Applications 218
8.1.3 Challenges 222
8.1.4 Conclusion 224
8.2 Applications of IR-LEDs 225
8.2.1 Structures 226
8.2.2 Applications 227
8.2.3 Challenges 231
8.2.4 Conclusion 232
8.3 Future Outlook and Other Technology Trends 233
8.3.1 Better Light Sources 233
8.3.2 Interconnection 234
8.3.3 Interaction with Humans 234
8.3.4 Light on Demand 235
References 235
Index 243
前言 The technical level and development scale of the integrated circuit (IC) industry is one of the important indicators to measure a country’s industrial competitiveness and comprehensive national strength, and is the source of modern economic development. The application of IC has already become routine in arious industries, such as military satellites, radar, civilian automotive electronics, smart equipment, and consumer electronics, etc. At present, the IC industry has formed three major industrial chains of design, manufacturing and packaging testing, which have become the indispensable pillar in the IC industry.
IC packaging is an indispensable process in the IC industry, which is the bridge from chip to device and device to system. It is a key fundamental manufacturing part of the IC industry and a competitive commanding height for the core device manufacturing of the IC industry.
The technical level and development scale of the integrated circuit (IC) industry is one of the important indicators to measure a country’s industrial competitiveness and comprehensive national strength, and is the source of modern economic development. The application of IC has already become routine in arious industries, such as military satellites, radar, civilian automotive electronics, smart equipment, and consumer electronics, etc. At present, the IC industry has formed three major industrial chains of design, manufacturing and packaging testing, which have become the indispensable pillar in the IC industry.
IC packaging is an indispensable process in the IC industry, which is the bridge from chip to device and device to system. It is a key fundamental manufacturing part of the IC industry and a competitive commanding height for the core device manufacturing of the IC industry.
With the rapid development of IC technology, higher and higher requirements for miniaturization, multi-function, high reliability and low cost of electronic products are put forward. Facing this situation, the electronic packaging materials and technologies are undergoing rapid development, promoting lots of advanced packaging materials. Advanced electronic packaging materials and technologies are the core of IC packaging.
In order to promote the development of China’s advanced electronic packaging industry and meet the urgent needs of researchers ranged from teaching and scientific study to engineering developing in the field of electronic packaging, the editorial committee has invited famous specialists to write the Series on Advanced Electronic Packaging Technology and Key Materials in recent years (English version). The series includes: “Advanced Polyimide Materials” “From LED to Solid State Lighting ” “Freeform Optics for LED Packages and Applications” “Modeling, Analysis, Design and Tests for Electronics Packaging beyond Moore” “TSV(through-silicon via technology) Package” etc.
This series of books systematically describes the advanced electronic packaging from three aspects: advanced packaging materials, advanced packaging technologies and advanced packaging simulation design methods. This series covers the most advanced packaging materials such as polyimide materials and packaging technologies such as freeform optical technology, TSV (through-silicon via technology) packaging, and advanced packaging simulation design methods such as multi-physics analysis and applications. In addition, this series also makes a planning outlook and forecast for the development trend of advanced electronic packaging.
This series of books is of great worth for workers engaged in scientific research, production and application in electronic packaging and related industries, and also has great reference significance for teachers and students of related majors in higher education institutions.
We believe that the publication of this series of books will play a positive role in promoting the development of China’s IC industry and advanced electronic packaging industry.
Finally, we would like to express our sincere gratitude to our colleagues who have worked hard in the preparation of this series. We also express our heartfelt thanks to those who participated in organizing the publication of this series!
C.P.
IEEE Fellow
Member of Academy of Engineering of the USA
Member of Chinese Academy of Engineering
Former Bell Labs Fellow
Dean of Engineering, The Chinese University of Hong Kong
Regents’ Professor, Georgia Institute of Technology, Atlanta, GA 30332, USA
Sheng Liu, Ph.D.
IEEE Fellow, ASME Fellow
Chang Jiang Scholar Professor
Dean, School of Power and Mechanical Engineering,
Founding Executive Director, Institute of Technology Sciences
Associate Dean of School of Microelectronics, Wuhan University
Professor of School of Mechanical Science and Engineering
Huazhong University of Science and Technology
Wuhan, Hubei, China
Wenhui Zhu, Ph.D.
National Invited Professor
College of Mechanical and Electrical Engineering,
Central South University
Changsha, Hunan, China
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